Altium

Design Rule Verification Report

Date: 6/28/2017
Time: 12:01:19 PM
Elapsed Time: 00:00:02
Filename: C:\dhs_root\Hardware\Colorado - EVB\QFN Evaluation Board\RSL10_QFN_IoT_V1.0\RSL10_QFN_IoT_V1.0.PcbDoc
Warnings: 0
Rule Violations: 37

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=10mil) (InNamedPolygon('GND_L01_P036')),(All) 0
Clearance Constraint (Gap=6mil) (All),(All) 22
Clearance Constraint (Gap=10mil) (InNamedPolygon('GND_L03_P038')),(All) 0
Clearance Constraint (Gap=10mil) (InNamedPolygon('GND_L01_P036')),(All) 0
Clearance Constraint (Gap=10mil) (InNamedPolygon('GND_L02_P010')),(All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Width Constraint (Min=5mil) (Max=50mil) (Preferred=10mil) (All) 3
Power Plane Connect Rule(Direct Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Hole Size Constraint (Min=1mil) (Max=100mil) (All) 4
Hole To Hole Clearance (Gap=10mil) (All),(All) 0
Minimum Solder Mask Sliver (Gap=3mil) (All),(All) 7
Silk to Silk (Clearance=0mil) (All),(All) 0
Net Antennae (Tolerance=0mil) (All) 1
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All) 0
Total 37

Clearance Constraint (Gap=6mil) (All),(All)
Clearance Constraint: (5.157mil < 6mil) Between Via (1432mil,1527mil) from Top Layer to Bottom Layer And Pad C4-2(1454.999mil,1535.316mil) on Top Layer
Clearance Constraint: (5.827mil < 6mil) Between Track (1555.118mil,1182.78mil)(1555.118mil,1207.402mil) on Top Layer And Pad U1-47(1570.866mil,1207.402mil) on Top Layer
Clearance Constraint: (5.827mil < 6mil) Between Track (1555.118mil,1182.78mil)(1555.118mil,1207.402mil) on Top Layer And Pad U1-45(1539.37mil,1207.402mil) on Top Layer
Clearance Constraint: (5.827mil < 6mil) Between Track (1492.126mil,1172.874mil)(1492.126mil,1207.402mil) on Top Layer And Pad U1-43(1507.874mil,1207.402mil) on Top Layer
Clearance Constraint: (5.827mil < 6mil) Between Track (1492.126mil,1172.874mil)(1492.126mil,1207.402mil) on Top Layer And Pad U1-41(1476.378mil,1207.402mil) on Top Layer
Clearance Constraint: (5.819mil < 6mil) Between Track (1386.394mil,1263.874mil)(1387.402mil,1264.882mil) on Top Layer And Pad U1-35(1387.402mil,1249.134mil) on Top Layer
Clearance Constraint: (5.827mil < 6mil) Between Track (1363.386mil,1233.386mil)(1387.402mil,1233.386mil) on Top Layer And Pad U1-35(1387.402mil,1249.134mil) on Top Layer
Clearance Constraint: (5.961mil < 6mil) Between Track (1570mil,1433.464mil)(1570mil,1434.687mil) on Top Layer And Pad U1-15(1555.118mil,1432.598mil) on Top Layer
Clearance Constraint: (5.961mil < 6mil) Between Track (1570mil,1433.464mil)(1570.866mil,1432.598mil) on Top Layer And Pad U1-15(1555.118mil,1432.598mil) on Top Layer
Clearance Constraint: (5.827mil < 6mil) Between Track (1612.598mil,1375.118mil)(1633.438mil,1375.118mil) on Top Layer And Pad U1-11(1612.598mil,1390.866mil) on Top Layer
Clearance Constraint: (5.827mil < 6mil) Between Track (1612.598mil,1406.614mil)(1614.412mil,1406.614mil) on Top Layer And Pad U1-11(1612.598mil,1390.866mil) on Top Layer
Clearance Constraint: (5.827mil < 6mil) Between Track (1612.598mil,1375.118mil)(1633.438mil,1375.118mil) on Top Layer And Pad U1-9(1612.598mil,1359.37mil) on Top Layer
Clearance Constraint: (5.921mil < 6mil) Between Track (1612.598mil,1375.118mil)(1633.438mil,1375.118mil) on Top Layer And Track (1612.598mil,1359.37mil)(1613.425mil,1360.197mil) on Top Layer
Clearance Constraint: (5.921mil < 6mil) Between Track (1612.598mil,1375.118mil)(1633.438mil,1375.118mil) on Top Layer And Track (1613.425mil,1360.197mil)(1630.126mil,1360.197mil) on Top Layer
Clearance Constraint: (5.203mil < 6mil) Between Track (1633.438mil,1375.118mil)(1642mil,1383.297mil) on Top Layer And Track (1630.126mil,1360.197mil)(1631.047mil,1361.118mil) on Top Layer
Clearance Constraint: (5mil < 6mil) Between Track (1612.598mil,1375.118mil)(1633.438mil,1375.118mil) on Top Layer And Track (1630.126mil,1360.197mil)(1631.047mil,1361.118mil) on Top Layer
Clearance Constraint: (5mil < 6mil) Between Track (1633.438mil,1375.118mil)(1642mil,1383.297mil) on Top Layer And Track (1631.047mil,1361.118mil)(1636.047mil,1361.118mil) on Top Layer
Clearance Constraint: (5mil < 6mil) Between Track (1612.598mil,1375.118mil)(1633.438mil,1375.118mil) on Top Layer And Track (1631.047mil,1361.118mil)(1636.047mil,1361.118mil) on Top Layer
Clearance Constraint: (4.574mil < 6mil) Between Track (1633.438mil,1375.118mil)(1642mil,1383.297mil) on Top Layer And Track (1636.047mil,1361.118mil)(1636.929mil,1362mil) on Top Layer
Clearance Constraint: (4.574mil < 6mil) Between Track (1612.598mil,1375.118mil)(1633.438mil,1375.118mil) on Top Layer And Track (1636.047mil,1361.118mil)(1636.929mil,1362mil) on Top Layer
Clearance Constraint: (4.574mil < 6mil) Between Track (1633.438mil,1375.118mil)(1642mil,1383.297mil) on Top Layer And Track (1636.929mil,1362mil)(1648.456mil,1362mil) on Top Layer
Clearance Constraint: (4.574mil < 6mil) Between Track (1612.598mil,1375.118mil)(1633.438mil,1375.118mil) on Top Layer And Track (1636.929mil,1362mil)(1648.456mil,1362mil) on Top Layer
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Width Constraint (Min=5mil) (Max=50mil) (Preferred=10mil) (All)
Width Constraint: Track (2623.071mil,585.079mil)(2623.071mil,1175.63mil) on Top Layer Actual Width = 59.055mil, Target Width = 50mil
Width Constraint: Track (2583.701mil,1215mil)(2623.071mil,1175.63mil) on Top Layer Actual Width = 59.055mil, Target Width = 50mil
Width Constraint: Track (2190mil,1215mil)(2583.701mil,1215mil) on Top Layer Actual Width = 59.055mil, Target Width = 50mil
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Hole Size Constraint (Min=1mil) (Max=100mil) (All)
Hole Size Constraint: (125.984mil > 100mil) Pad Free-0(600mil,2000mil) on Multi-Layer Actual Hole Size = 125.984mil
Hole Size Constraint: (125.984mil > 100mil) Pad Free-0(550mil,100mil) on Multi-Layer Actual Hole Size = 125.984mil
Hole Size Constraint: (125.984mil > 100mil) Pad Free-0(2600mil,1400mil) on Multi-Layer Actual Hole Size = 125.984mil
Hole Size Constraint: (125.984mil > 100mil) Pad Free-0(2600mil,300mil) on Multi-Layer Actual Hole Size = 125.984mil
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Minimum Solder Mask Sliver (Gap=3mil) (All),(All)
Minimum Solder Mask Sliver Constraint: (1.018mil < 3mil) Between Via (1033.098mil,2222.155mil) from Top Layer to Bottom Layer And Pad R41-1(1024.685mil,2250mil) on Top Layer [Top Solder] Mask Sliver [1.018mil]
Minimum Solder Mask Sliver Constraint: (2.803mil < 3mil) Between Via (1128.813mil,2207.803mil) from Top Layer to Bottom Layer And Pad R50-1(1131.559mil,2178.173mil) on Top Layer [Top Solder] Mask Sliver [2.803mil]
Minimum Solder Mask Sliver Constraint: (2.861mil < 3mil) Between Pad U5-24(110.657mil,2170.581mil) on Top Layer And Pad U5-1(86.051mil,2145.975mil) on Top Layer [Top Solder] Mask Sliver [2.861mil]
Minimum Solder Mask Sliver Constraint: (2.861mil < 3mil) Between Pad U5-7(110.657mil,2022.943mil) on Top Layer And Pad U5-6(86.051mil,2047.55mil) on Top Layer [Top Solder] Mask Sliver [2.861mil]
Minimum Solder Mask Sliver Constraint: (2.861mil < 3mil) Between Pad U5-13(233.689mil,2047.55mil) on Top Layer And Pad U5-12(209.083mil,2022.943mil) on Top Layer [Top Solder] Mask Sliver [2.861mil]
Minimum Solder Mask Sliver Constraint: (2.861mil < 3mil) Between Pad U5-19(209.083mil,2170.581mil) on Top Layer And Pad U5-18(233.689mil,2145.975mil) on Top Layer [Top Solder] Mask Sliver [2.861mil]
Minimum Solder Mask Sliver Constraint: (0.837mil < 3mil) Between Via (620.096mil,672.798mil) from Top Layer to Bottom Layer And Pad R54-2(600mil,700.315mil) on Top Layer [Top Solder] Mask Sliver [0.837mil]
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Net Antennae (Tolerance=0mil) (All)
Net Antennae: Track (2623.071mil,585.079mil)(2623.071mil,1175.63mil) on Top Layer
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